TOGA TISKANA VEZJA

HDI TISKANA VEZJA

An HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB.

The HDI PCBs we offer include the following highly requested characteristics:

Blind and / or buried vias
Via-in-pad
Through vias from surface to surface
Stacked microvias (plated copper or filled with conductive paste)
Cavities, countersunk holes or depth milling
Solder resist in black, blue, green, etc.
Low-halogen material in standard and high Tg range

METAL CORE PCBS

We offer following products:

Materials with prepreg or thermally conductive resins
Thermal conductivity in the range from 0.35-8.0 W/(m.K)
Scored or routed versions
White or black solder resist
Double sided Al boards: In the middle of PCB is a metal core (aluminum or copper)
Usage: Automotive and LED-Applications

HEAVY COOPER PCBS

Thick-Copper technology offers the possibility to implement complex switches in limited space in combination with circuitry for high current levels.

We have reliable processes to produce copper layer thicknesses up to 435 µm.
"Thick Copper Board" is defined as any circuit with a thickness over 140 microns of copper deposit.

TECHNICAL POSSIBILITY

FEATURE	TECHNICAL POSSIBILITY
Layer	1 - 58
Base material	FR-4, CEM1, High TG FR-4 Metal core / aluminum /IMS/ Rogers, Polyamide, PPE, PPO etc.
Combined Laminate	FR4 + Rogers, FR4 + PTFE
Max. Working dimension	610 mm X 1100 mm / 24015.748 mils - 43307.086 mils
Outer-Tolerance	±0.10 mm / ± 3.937 mils
PCB thickness	0.15 mm - 10.00 mm / 5.905 mils – 393.70 mils
Tolerance PCB-thickness > 0,8 mm / 31.496 mils	±5%
Inner layer thickness	0.10 mm - 6.00 mm / 3.937 mils - 236.22 mils
Min. Trace width	0.075 mm / 2.953 mils
Min. Trace distance	0.075 mm / 2.953 mils
Copper thickness outer Layer	35 µm - 210 µm
Copper thickness inner Layer	17 µm - 175µm
Drill diameter / mechanical /	0.15 mm - 6.35 mm / 5.905 mils – 248.03 mils
Finished hole diameter	0.10 mm - 6.30 mm / 3.937 mils – 250.00 mils
Tolerance for hole diameter	± 0.05 mm/ ± 1.968 mils
Registration / mechanical /	0.065 mm / 2.559 mils
Min. hole diameter / Laser-drill /	0.10 mm / 3.973 mils
Aspect Ratio	18:1
Solder mask Type	LPI
Min. LPI- width	0.075 mm / 2.953 mils
Solder mask color	green / white / black / red / blue
Min. Solder mask distance	0.05 mm / 1.968 mils
PTH thickness	0.25 mm--0.60 mm / 9.842 mils – 23.622 mils
Tolerance at controlled Impedance	±10%
Surface finish	HAL with Sn/Pb ; Chemical tin; Chem. Ni/Au; Chemical SN; OSP; HAL lead free; Galvanic Ni/Au
Additional requirements	Buried Via / Blind Via / Buried Resistor

RIGID PCB