HDI PCB

An HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. They have much finer lines and spaces, smaller vias and capture pads, and higher connection pad density than employed in conventional PCB technology.

The HDI PCBs we offer include the following highly requested characteristics:

  • Blind and / or buried vias
  • Via-in-pad
  • Through vias from surface to surface
  • Stacked microvias (plated copper or filled with conductive paste)
  • Cavities, countersunk holes or depth milling
  • Solder resist in black, blue, green, etc.
  • Low-halogen material in standard and high Tg range

METAL CORE PCBS

We offer following products:

  • Materials with prepreg or thermally conductive resins
  • Thermal conductivity in the range from 0.35-8.0 W/(m.K)
  • Scored or routed versions
  • White or black solder resist
  • Double sided Al boards: In the middle of PCB is a metal core (aluminum or copper)
  • Usage: Automotive and LED-Applications

HEAVY COOPER PCBS

Thick-Copper technology offers the possibility to implement complex switches in limited space in combination with circuitry for high current levels.

We have reliable processes to produce copper layer thicknesses up to 435 µm.
"Thick Copper Board" is defined as any circuit with a thickness over 140 microns of copper deposit.

TECHNICAL POSSIBILITY

FEATURE TECHNICAL POSSIBILITY
Layer 1 - 58
Base material FR-4, CEM1, High TG FR-4
Metal core / aluminum /IMS/
Rogers, Polyamide, PPE, PPO etc.
Combined Laminate FR4 + Rogers, FR4 + PTFE
Max. Working dimension 610 mm X 1100 mm / 24015.748 mils - 43307.086 mils
Outer-Tolerance ±0.10 mm / ± 3.937 mils
PCB thickness 0.15 mm - 10.00 mm / 5.905 mils – 393.70 mils
Tolerance PCB-thickness  > 0,8 mm / 31.496 mils ±5%
Inner layer thickness 0.10 mm - 6.00 mm / 3.937 mils - 236.22 mils
Min. Trace width 0.075 mm / 2.953 mils
Min. Trace distance 0.075 mm / 2.953 mils
Copper thickness outer Layer 35 µm - 210 µm
Copper thickness inner Layer 17 µm - 175µm
Drill diameter  / mechanical / 0.15 mm - 6.35 mm / 5.905 mils – 248.03 mils
Finished hole diameter 0.10 mm - 6.30 mm / 3.937 mils – 250.00 mils
Tolerance for hole diameter ± 0.05 mm/ ± 1.968 mils
Registration   / mechanical / 0.065 mm / 2.559 mils
Min. hole diameter / Laser-drill / 0.10 mm / 3.973 mils
Aspect Ratio 18:1
Solder mask Type LPI
Min. LPI- width 0.075 mm / 2.953 mils
Solder mask color green / white / black / red / blue
Min. Solder mask distance 0.05 mm / 1.968 mils
PTH thickness 0.25 mm--0.60 mm / 9.842 mils – 23.622 mils
Tolerance at controlled  Impedance ±10%
Surface finish HAL with Sn/Pb ; Chemical tin; Chem. Ni/Au; Chemical SN; OSP;
HAL lead free; Galvanic Ni/Au
Additional requirements Buried Via  /
Blind Via /
Buried Resistor
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