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             ML pcb blue                prerez ML

 

FEATURE

TECHNICAL POSSIBILITY

Layer 

1 - 58

Base material

FR-4, CEM1, High TG FR-4

Metal core / aluminum /IMS/

Rogers, Polyamide, PPE, PPO etc.

Combined Laminate

FR4 + Rogers, FR4 + PTFE

Max. Working dimension

610 mm X 1100 mm / 24015.748 mils - 43307.086 mils

Outer-Tolerance

±0.10 mm / ± 3.937 mils

PCB thickness

0.15 mm - 10.00 mm / 5.905 mils – 393.70 mils

Tolerance PCB-thickness  > 0,8 mm / 31.496 mils

±5%

Inner layer thickness

0.10 mm - 6.00 mm / 3.937 mils - 236.22 mils

Min. Trace width

0.075 mm / 2.953 mils

Min. Trace distance

0.075 mm / 2.953 mils

Copper thickness outer Layer

35 µm - 210 µm

Copper thickness inner Layer

17 µm - 175µm

Drill diameter  / mechanical /

0.15 mm - 6.35 mm / 5.905 mils – 248.03 mils

Finished hole diameter

0.10 mm - 6.30 mm / 3.937 mils – 250.00 mils

Tolerance for hole diameter

± 0.05 mm/ ± 1.968 mils

Registration   / mechanical /

0.065 mm / 2.559 mils

Min. hole diameter / Laser-drill /

0.10 mm / 3.973 mils

Aspect Ratio

18:1

Solder mask Type

LPI

Min. LPI- width

0.075 mm / 2.953 mils

Solder mask color

green / white / black / red / blue

Min. Solder mask distance

0.05 mm / 1.968 mils

PTH thickness

0.25 mm--0.60 mm / 9.842 mils – 23.622 mils

Tolerance at controlled  Impedance

±10%

Surface finish

HAL with Sn/Pb ; Chemical tin; Chem. Ni/Au; Chemical SN; OSP;

HAL lead free; Galvanic Ni/Au

Additional requirements

Buried Via  /

Blind Via /

Buried Resistor